Power Delivery, Cooling, and Practically Operable Capacity

4.28.1PCIe Air Cooling, SXM/OAM, and Rack-Scale Direct Liquid Cooling#

4.28.2Power Budgets at Chip, Board, Rack, and Facility#

4.28.3Power Distribution, Busbar, Voltage Conversion, and Conductor Constraints#

4.28.454 VDC and the Higher-Voltage Delivery Direction Proposed in the Survey#

4.28.5Coolant Temperature, Thermal Resistance, and Operating Temperature Margin#

4.28.6Integration Density, Copper Interconnect Distance, and Cooling Form Factor#

4.28.7Average Power, Synchronized Power Swings, and Short-Term Energy Storage#

4.28.8Installed Capacity, Power-Capped Capacity, and Cooling-Limited Capacity#

4.28.9Reliability Extension: ECC, Link RAS, Hardware Fault Isolation, and Maintenance#