Packaging, Chiplets, and Logic–Memory Integration

SourcesSurvey §5.3, §5.4 and §6.2; d-Matrix/Raptor corpus record. UCIe is retained as an extension.

4.13.1Monolithic Die, Multi-Chip Module, and Compute/I/O Die#

4.13.2HBM Stack, Interposer, and 2.5D Packaging#

4.13.33D Stacking, Logic–DRAM Bonding, and Local Datapaths#

4.13.4Memory Density, Stack Count, Interface Width, and Signaling Rate#

4.13.5Chiplet Interconnect, Boards, Baseboards, and Compute Trays#

4.13.6SXM/OAM, Packaging Density, and Power and Thermal Constraints#

4.13.7The Raptor Early-Silicon Case and Thermal/Reliability Constraints#

4.13.8Further Reading: UCIe and General Die-to-Die Interfaces#