AI Architecture & Systems

Pod-Scale Scale-Up Interconnect

SourcesSurvey §4.3 and Fig. 8; Boardfly and UB-Mesh retain the announcement/proposal qualifications of the supplied draft.

4.18.1TPU Pod, 3D Torus, and Optical Circuit Switching#

4.18.2Boardfly: Four-Chip Building Block, Group, and Inter-Group Connection#

4.18.3UB-Mesh: Hierarchically Localized nD Full Mesh#

4.18.4Maia: Fully Connected Quad and Ethernet-Switched Hierarchy#

4.18.5Local/Global Connectivity, Oversubscription, and Scaling Limits#

4.18.6Distinguishing Deployed, Announced, and Proposed Topologies#