AI Architecture & Systems

Accelerator Taxonomy and Architecture Classes

4.2.1Core Taxonomy: Four Classes of AI Accelerator Architecture#

Specialized accelerators deliver substantially more throughput and better energy efficiency than general-purpose CPUs on AI workloads, but they do not all get there the same way. Four categories cover the dominant designs, separated by their primary execution and data-movement model — not by vendor, and not by which operations they happen to support.

High-level taxonomy of AI accelerator architectures.
CategoryComputer architectureRepresentative platforms
GPUGeneral-purpose SIMT architecture with dedicated tensor/matrix unitsNVIDIA GPU, AMD GPU
NPUHeterogeneous domain-specific architecture combining matrix, vector and scalar engines around a shared on-chip scratchpadGoogle TPU, AWS Trainium/Inferentia, Qualcomm Cloud AI, Huawei Ascend, Intel Gaudi, Microsoft Maia, Cambricon MLU
Spatial dataflowComputation graph mapped onto distributed compute, memory and communication resources, in three styles: PE array, reconfigurable fabric, functional-slice streamingPE array: Tenstorrent, Meta MTIA, Tesla Dojo, Graphcore IPU, Cerebras; reconfigurable: SambaNova; functional-slice: Groq
Compute-in-memoryMemory-centric architecture integrating compute logic in or near SRAM or DRAM to reduce data movementd-Matrix, SK hynix AiM, Samsung PIM
Four high-level AI accelerator architecture classes: GPU, NPU, spatial dataflow, and compute-in-memory.
Four high-level AI accelerator architecture classes: GPU, NPU, spatial dataflow, and compute-in-memory.

Each category exploits a different property of AI workloads: increasing data reuse, specializing compute resources, or improving data locality. Designs in the same category still differ in supported operations, memory organization, and how much of the chip stays general-purpose. GPUs keep SIMT cores beside their matrix units; NPUs such as Google TPU and AWS NeuronCore pair specialized matrix engines with vector, scalar or SIMD execution [1, 2, 3, 4]. Memory systems mix the same way, combining hardware-managed caching with software-managed storage for explicit reuse.

So the useful question is not what an accelerator is called. It is which computations and which data movements receive dedicated hardware support, and which are left to general-purpose hardware or to software. Each platform below is assigned a primary category by its dominant execution and data-movement model, while acknowledging that secondary mechanisms — systolic execution, compiler-managed placement, near-memory arithmetic — cut across categories.

Key architectural features of representative AI accelerators. Scale-up topologies refer to representative platforms rather than to the chip alone.
CategoryAcceleratorCompute enginesMemoryScale-up topology
GPUNVIDIA GPUSIMT + tensor coresHBMCube/hybrid cube mesh; switched all-to-all
GPUAMD GPUSIMT + matrix coresHBMDirect full mesh / switched all-to-all
NPUGoogle TPUMatrix + vector + scalar; SparseCore or collectives acceleration engine, depending on generationHBM2D / 3D torus; Boardfly
NPUAWS TrainiumMatrix + vector + scalar + programmable SIMDHBM2D torus; switched all-to-all
NPUQualcomm AI 100Matrix + VLIW vector and scalar unitsLPDDR—
NPUHuawei AscendMatrix + vector + scalar unitsHBMUB-Mesh: nD full mesh
NPUIntel GaudiMatrix + VLIW vector unitsHBMDirect full mesh
NPUMicrosoft MaiaMatrix + vector unitsHBMSwitched Ethernet
NPUCambricon MLUMatrix + vector + scalar unitsDDR4 / LPDDR / HBM—
SpatialTenstorrentRISC-V cores + matrix/vector unitsGDDR62D mesh Ethernet
SpatialMeta MTIAPE grid with matrix + vector unitsLPDDR / HBMSwitched PCIe / Ethernet-based fabrics
SpatialGraphcoreTile processors, FP16 vector MAC + FP32 scalar FPUDDR42D torus
SpatialTesla DojoTile processors, matrix + SIMD vector + scalar unitsOn-chip SRAM + HBM2D mesh die-to-die
SpatialCerebrasWafer-scale PE array; SIMD + scalar; data-triggered executionOn-chip SRAM2D mesh on-wafer
SpatialSambaNovaReconfigurable SIMD compute + memory tilesHBM + DDRDirect peer-to-peer RDU links (SN40L)
SpatialGroqMatrix/vector units + SRAM/switch slices; statically scheduledOn-chip SRAMDragonfly
CIMd-MatrixDigital in-SRAM MAC arrayLPDDR5Switched PCIe
CIMSK hynix AiMBF16 MAC-based PIM unitsGDDR6-AiM—
CIMSamsung PIMFP16 SIMD PIM processorsHBM-PIM—

4.2.2GPU: General-Purpose Parallel Execution and Specialized Matrix Computation#

GPU organization: SIMT cores with tensor units over shared memory and cache.
GPU organization: SIMT cores with tensor units over shared memory and cache.

GPUs keep the SIMT (single-instruction, multiple-thread) execution model that made them broadly programmable, and add tensor or matrix cores for the dense linear algebra that dominates modern AI [1, 5, 2, 6, 7]. That combination is the category's defining trait: nothing is given up in generality, and specialized throughput is layered on top.

Both NVIDIA and AMD use HBM to supply their high-throughput compute units. Scale-up topology, though, is a property of the platform rather than the chip: NVIDIA systems have used several different NVLink organizations across generations, including both direct-connect and switched fabrics [8], and AMD deployments range from directly connected GPU baseboards to the switched UALoE fabric of the MI455X-based Helios rack. This is why topology is always reported together with a system configuration rather than a part number.

Programmability, high-bandwidth memory and fast scale-up communication together are what let GPUs serve as the general-purpose substrate of large AI datacenters.

4.2.3NPU: Heterogeneous Compute Engines and Shared Local Memory#

NPU organization: matrix, vector, scalar, and special-function engines around a shared scratchpad.
NPU organization: matrix, vector, scalar, and special-function engines around a shared scratchpad.

NPUs answer the same demand with explicit heterogeneity. Representative designs include Google TPU [9, 3, 10, 11, 12, 13, 14], AWS Trainium [15, 16, 17], Qualcomm AI 100 [18], Huawei Ascend [19, 20], Intel Gaudi [21], Microsoft Maia [22] and Cambricon MLU [23].

Rather than one flexible core type, an NPU integrates several specialized ones and maps each kind of operator onto the block built for it: matrix engines for GEMM-intensive computation, vector units for activations and normalization, scalar units for control-oriented work. When operators map cleanly and the engines stay busy, this improves area and energy efficiency; when they do not, some engines sit idle. That conditional is the central trade of the category.

Some NPUs replicate a complete matrix–vector–scalar core and scale out across several of them. The Cambricon MLU is grouped here rather than with spatial dataflow for exactly this reason: it exposes a multi-core neural-processor ISA and runtime, not a tile-placement programming model.

Many NPUs use systolic arrays as their matrix engines. Instead of every processing element fetching operands from a central register file or SRAM, activation and weight streams are injected at the array boundary; interior elements take operands from their neighbours and propagate partial sums onward. Replacing most memory accesses with local neighbour-to-neighbour transfers cuts memory-bandwidth demand and saves energy. Google's TPUs pair systolic arrays for GEMM with SparseCores for embedding operations in some generations [3], while TPU 8i replaces them with a Collectives Acceleration Engine [14]. Other NPUs add programmable SIMD units for generality, as in the second-generation AWS NeuronCore [4].

Scale-up topologies across this category are unusually diverse — 2D and 3D torus, Boardfly, nD full mesh, direct full mesh, switched Ethernet and switched all-to-all all appear.

4.2.4Spatial Dataflow I: PE Arrays and Distributed Local Memory#

Spatial-dataflow organization in three forms: a processing-element array, a reconfigurable fabric, and functional-slice streaming.
Spatial-dataflow organization in three forms: a processing-element array, a reconfigurable fabric, and functional-slice streaming.

Spatial dataflow architectures map a computation graph directly onto distributed compute, memory and communication resources. Operator placement, local memory allocation and inter-operator data movement are all explicitly managed by the compiler and exposed to software, instead of being hidden behind caches or a centralized command stream. Controlling data movement explicitly cuts coordination overhead and memory traffic and improves locality — at the cost of requiring a compiler that can actually solve the placement problem.

PE array designs divide the chip into many programmable processing elements, each with private SRAM, connected by an on-chip network. The compiler spreads computation across them and schedules the transfers between them, so different elements can run different operators or different pipeline stages. Examples include Tenstorrent [24], Meta MTIA [25], Tesla Dojo [26] and Graphcore [27]. These systems support a wider range of memory technologies than GPUs and NPUs — GDDR6, LPDDR, DDR4 and HBM all appear.

Cerebras extends the approach to a wafer-scale mesh [28]. Fabric packets called wavelets carry data and control information and can activate tasks on a processing element. This data-triggered task scheduling coexists with local instruction sequencing: each element executes the instructions of its selected task, while the dataflow mechanism determines when work becomes ready.

4.2.5Spatial Dataflow II: Reconfigurable Architectures#

Not every spatial dataflow design replicates general-purpose processing elements. Reconfigurable architectures such as SambaNova instead provide configurable compute, memory and interconnect tiles, and the compiler maps operators and their data dependencies directly onto that fabric [29].

The distinction matters for how a design ages. In SambaNova's SN40L the compiler maps supported model graphs onto configurable tiles and programs the data routes between them, so reconfigurability buys flexibility as algorithms evolve — but only within a finite set of physical resources and supported operations [29].

4.2.6Spatial Dataflow III: Functional-Slice Streaming#

Functional-slice streaming processors, such as Groq, organize the chip into fixed functional units — matrix engines, vector engines, SRAM blocks and switches — and move data through them on a schedule the compiler decides in advance [30, 31].

The design deliberately removes the sources of timing variability that other architectures rely on. There are no caches to miss, no speculation, and no dynamic arbitration; instead the timing of computation and data movement is exposed to the compiler, which makes execution predictable. Groq extends the same principle to the network with software-scheduled networking, where the compiler resolves contention and forbids hardware backpressure, scheduling fine-grained transfers on each link for about 2.5% metadata overhead [31]. Predictability is the product here, and it is bought by moving nearly every scheduling decision to compile time.

4.2.7Compute-in-Memory: SRAM, DRAM, and the Location of Computation#

Compute-in-memory organization: arithmetic inside memory arrays or in logic tightly coupled to memory banks.
Compute-in-memory organization: arithmetic inside memory arrays or in logic tightly coupled to memory banks.

The fourth category attacks the memory bottleneck at its source by putting arithmetic where the data already is. Representative designs include d-Matrix [32], SK hynix AiM [33] and Samsung PIM [34], using digital in-SRAM MAC arrays or MAC-based and SIMD processing-in-memory units.

The motivating observation is that many AI workloads are limited not by arithmetic throughput but by the energy and latency of moving weights and activations between memory and compute. SRAM-based compute-in-memory augments bit cells and peripheral circuitry to compute inside the array [32]. DRAM-based near- and in-memory processing places vector or SIMD units beside DRAM banks and operates on data in the row buffers, doing bulk computation without crossing the external memory interface [35, 34]. Collapsing the usual load–compute–store sequence into local, highly parallel operations exploits the internal bandwidth of SRAM arrays and DRAM banks directly.

Where this pays off is specific. Compute-in-memory suits bandwidth-bound work with little temporal reuse: GEMV and matrix–vector operations at small batch sizes, embedding and projection layers, and sparse or irregular computation where a systolic array cannot fill its reuse pipeline. Workloads with high arithmetic intensity, such as large-batch GEMM, are better served by matrix engines designed to amplify reuse. Architecturally the category offers high internal parallelism but limited flexibility, and its programmability depends heavily on data layout and compiler scheduling keeping operands resident.

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